Cited as a reference · for advanced
Decapping ICs (removing epoxy packaging from chips to expose the dies)
Why people recommend it
Shows the process of stripping the epoxy from an integrated circuit to expose the die, linked to illustrate what decapping involves and how chips are encapsulated.
Watch for: involves hot nitric acid; not a beginner activity
In their words
This YouTube video demonstrates a process for removing the resin packaging on ICs using a hotplate, nitric acid, acetone, and a rotary tool.
wgardiner on electronics.stackexchange.com, May 2014. CC BY-SA.
