1 Decapping ICs (removing epoxy packaging from chips to expose the dies)
Shows the process of stripping the epoxy from an integrated circuit to expose the die, linked to illustrate what decapping involves and how chips are encapsulated.
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Shows the process of stripping the epoxy from an integrated circuit to expose the die, linked to illustrate what decapping involves and how chips are encapsulated.
CuriousMarc's demonstration of opening plastic chip packages using hot air and pliers, recommended as a simple low-chemical way to expose a die for photos or study.