1 Decapping ICs (removing epoxy packaging from chips to expose the dies)
Shows the process of stripping the epoxy from an integrated circuit to expose the die, linked to illustrate what decapping involves and how chips are encapsulated.
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Shows the process of stripping the epoxy from an integrated circuit to expose the die, linked to illustrate what decapping involves and how chips are encapsulated.
Sam Zeloof's demonstration of manual wire bonding is the usual pointer for anyone curious how a chip die gets connected to its package.